PCB Capabilities
| Description | Technical Parameters |
|---|---|
| Quality Grade | Standard IPC 2 |
| Order Quantity | 1pc – 5000+pcs |
| Layer | 1-40 |
| Board Material | FR4 High TG FR4 Aluminum Base High Frequency Rogers FPC |
| Product Type | HDI, Blind/Burried vias Thick Gold heavey Copper Impedance Control Via in Pad peelable solder mask |
| Min Trace/Space | 3mil |
| Min Hole Size | NC drill 0.2mm Laser Drill 0.1mm |
| Max. Min.Board thickness | 6mm 0.2mm |
| Max.Board Size | 600*450mm |
| Min. Routing Size | 0.5mm plated 0.8mm unplated |
| Solder Mask | Mask Bridge 6mil Color: White, black,Blue Green,Yellow Red, Matt Green, Matt black |
| Surface Finish | HASL Lead Free HASL ENIG |
| Copper weight | 6oz |